WLP Uncooled IR Detector

Wafer-level packaging is a wafer-level package, wafer-level test of many MEMS structures on a wafer, and then split into a complete vacuum-tight infrared detector, suitable for high-volume and low-cost production and application.

Features:

• High performance at low cost;

• Ultra-small size, ultra-light weight;

• High sensitivity and excellent imaging quality;

Application:

• Smart Home

• Consumer Electronics

• Internet of Things

• Automatic Driving

• Industrial Inspection

• Security/Surveillance

• Personal Vision

• Firefighting